ALUCOIL, in the VII International Congress on Architectural Envelopes

ALUCOIL will participate in the VII International Congress on Architectural Envelopes which wil take place from the 27th until the 29th May at the Palace Congress and Kursaal Auditorium located in San Sebastian (SPAIN). A technical team from ALUCOIL will attend the congress and will make a presentation on the 27th May under the name “The Honeycomb Panel: The response to the new Architectural Requirements”.

The ALUCOIL technical team will present the new world of architectural possibilities that larcore® opens up, an aluminium honeycomb panel, an ultimate generation material designed and manufactured by ALUCOIL.

Find more info here.